Information
Application:
ENIG is one of final surface treatment processes for PCB for depositing a layer of nickel and gold on copper surface; ENIG belongs to medium phosphorus and medium~high phosphorus series, and has excellent solderability, corrosion and wear resistance, and is an ideal process designed in particular for final surface of PCB.
Advantage introduction:
Applicable to the manufacturing of fine circuits;
High corrosion resistance;
No gold peel off upon OSP micro etch for 5 times;
Excellent solderability.